UN Number: UN1219 CL3 II
Limited Quantity: 1L
Hazardous for transport
Future not only improves soldering performance (no bridges or icicles) but also reduces costs as cleaning is not necessary.
Future 315 Low Residue No Clean Flux offers excellent
solderability with the minimal level of flux residue. Future
315 Low Residue No Clean is suitable for spray or foam fluxing systems.
- Future 315 Low Residue No Clean Flux is suitable for conventional, mixed and surface mount technologies.
- For telecommunications, computer and general consumer electronics.
Orders over £50 placed online will now qualify for FREE UK Mainland delivery*
Orders under £50 placed online for UK Mainland delivery is £6.95*
Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50**
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.
DocumentsSil-Mid Limited DO NOT GUARANTEE that the information on this page is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.