Quick View

Multicore MP 100 Solder Paste has been formulated as a pale, softresidue product for printing and reflow in air, where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface finishes.

 See Options
Bulk discounts
1+
£240.68 + VAT
6+
£228.65 + VAT
12+
£222.63 + VAT
24+
£216.61 + VAT
Basket
Skip to main content
Continue Shopping View Basket

Multicore MP 100 SN62 Solder Paste 500gm Jar (Fridge Storage)

Silmid P/N: SN62MP100AGS90
Multicore MP 100 SN62 Solder Paste 500gm Jar (Fridge Storage)
Remove From Favourites Add To Favourites
£240.68 (excl VAT) £288.82 (Inc VAT)
Available to Back Order - 10 available in 13 days
Bulk discounts
1+
£240.68 + VAT
6+
£228.65 + VAT
12+
£222.63 + VAT
24+
£216.61 + VAT

Multicore MP 100 Solder Paste has been formulated as a pale, softresidue product for printing and reflow in air, where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface finishes.

Technical Information

  • UN Number 3082 CL9
  • Commodity Code 83113000
  • Country of Origin Hungary

Please Note: Harimatec have purchased the rights to manufacture the Multicore range of products from Henkel Loctite. Please note, some existing Henkel Loctite stock remains in the supply chain, so you may receive either brand.

Data Sheets

Download the Multicore MP 100 SN62 technical data sheet (TDS) and the Multicore MP 100 SN62 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
500gm Jar
Product Colour
Grey
Brand
Multicore
Manufacturer Name
Harimatec
Also Known As
Loctite Multicore MP 100 SN62 Solder Paste

Product Information

Features:

  • Effective over a wide range of printer cycle times and squeegee speeds
  • Extended “between-print” abandon time
  • Version suitable for ultra-fine pitch and 0201 chips
  • Long component tack time
  • Resists solder balling
  • Excellent spread on a wide range of solderable surfaces
  • Effective over a wide range of reflow profiles in air or nitrogen
  • Soft, non-sticky post reflow residues for reduced maintenance in-circuit electrical testing
  • Low colour post-reflow residues for easy visual inspection

Shipping information

Please refer to our delivery page for more information.