Multicore MP100 medium from Henkel Loctite is a pale, soft residue product for printing and reflow in air, where process yield is critical.
£77.55 excl VAT
£93.06 inc VAT
13 In Stock
UN Number: UN3082 CL9 III
Commodity Code: 83113000
£77.55 + VAT
£73.67 + VAT
£71.73 + VAT
£69.80 + VAT
MP100 solder pastes offer excellent open time and greatly extended abandon times. They ensure good soldering activity over a wide range of reflow profile types and surface finishes.
The MP100 paste contains Type 3 (AGS) solder powder, which is formulated for high volume stencil printing applications with component lead pitches down to 0.4mm.
Its flux is formulated to provide excellent wetting on all common board and component lead finishes, including OSP copper that may have been passed through multiple reflow processes in air.
- Version suitable for ultra-fine pitch and 0201 chips
- Long component tack time
- Resists solder balling
- Excellent spread on a wide range of solderable surfaces
- Low colour post reflow residues for easy visual inspection
- (Fridge Storage 0 - 10°C)
- 500gm Jar
Orders over £50 placed online will now qualify for FREE UK Mainland delivery*
Orders under £50 placed online for UK Mainland delivery is £6.95*
**Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50, orders placed through the office will incur additional charges.**
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.
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