Alpha S64 can be applied by manual dipping, brushing or alternatively by the foam method in an automated wave soldering system. The materials specific gravity should be monitored to ensure consistent performance, particularly when foaming is used as the application method.
During use solvents in the material will be lost due to their volatile nature, thus increasing the specific gravity. This can be adjusted with the addition of Alpha 425 thinners.
- Free from corrosive or hygroscopicv inclusions
- Fast acting activator package
- Provides a rapid cleaning action and excellent wetting
- Alpha S64
- Dipping Flux
Specifications and Information
Document DownloadsSil-Mid Limited DO NOT GUARANTEE that the information in these documents is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.
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