Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C)
LOCTITE ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal lead frames.
Technical Information
- Commodity Code 35061000
- Country of Origin South Korea
Data Sheets
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Product Information
It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realised through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
Features:
- Electrically conductive
- Thermally conductive
- One component
- Ease of use Void-free bondline
- Hydrophobic Stable at high temperatures
- High resistance to delamination
- Good resistance to
popcorning
after exposure to reflow temperatures
Additional Content
Shipping information
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