QMI519Ã¢â€žÂ¢ is a silver filled conductive adhesive for attachment of integrated circuits and components to metal leadframes advanced substrates.
£150.62 excl VAT
£180.74 inc VAT
No stock - lead time 45 days
£150.62 + VAT
£146.66 + VAT
£142.70 + VAT
- This material is hydrophobic and stable
at high temperatures.
- These features produce a void-free bond
line with excellent interfacial adhesion strength to a wide
variety of metal surfaces, including Palladium, Alloy 42 .
- The adhesive also has excellent electrical and thermal conductivity properties.
- QMI519â„¢ is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives.
Orders over £50 placed online will now qualify for FREE UK Mainland delivery*
Orders under £50 placed online for UK Mainland delivery is £6.95*
Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50**
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.
DocumentsSil-Mid Limited DO NOT GUARANTEE that the information on this page is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.