HexBond™ 322U Modified Epoxy Film Adhesive 300gsm 40SqMt Roll (Freezer Storage -18°C)
HexBond 322U is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures.
Technical Information
- Commodity Code 39209928
- Country of Origin United Kingdom
Data Sheets
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Product Information
HexBond 322U is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220°C for short periods, or 200°C for continuous operation. HexBond 322U is a hot melt film which is free from solvents and consequently has a very low volatile content.
Features:
- Cure at 175°
- Good co-cure potential with 175°C curing prepregs
- Good hot lap shear performance
- Good high temperature performance in metal sandwich structures
- Low volatile content and low out gassing properties
- Available with or without a woven nylon carrier
Applications:
- Metal to metal bonding
- Sandwich constructions
Shipping information
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