Redux® 322 is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220°C for short periods, or 200°C for continuous operation. Redux® 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.
- Cure at 175°C
- Good co-cure potential with 175°C curing prepregs
- Good hot lap shear performance
- Good high temperature performance in metal sandwich structures
- Low volatile content and low out gassing properties
- Available with or without a woven nylon carrier
- Metal to metal bonding
- Sandwich constructions
Orders over £50 placed online will now qualify for FREE UK Mainland delivery*
Orders under £50 placed online for UK Mainland delivery is £6.95*
Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50**
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.
DocumentsSil-Mid Limited DO NOT GUARANTEE that the information on this page is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.