Lord CoolTherm EP-2000 A/B Epoxy Adhesive 1USG Kit
CoolTherm EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.
Technical Information
- Commodity Code 38249992
- Country of Origin United States
Data Sheets
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Product Information
Features:
- Excellent Heat Dissipation – provides lower motor end winding temperatures during high-power operation
- Low Viscosity – provides fine-particle filler and low viscosity; self-levels to fill voids in motor stators/rotors, transformer coils and other electrical devices
- Durable – cured material resists cracking during multiple thermal cycles from sub-zero temperatures to 200°C
Shipping information
Please refer to our delivery page for more information.