Loctite 3609 Chipbond Epoxy Adhesive 10ml Syringe (Fridge Storage)
Loctite 3609 is designed for the bonding of surface mount devices to printed circuit boards prior to wave soldering. This product is particulary suited where very high speed dispensing, high dot profile, high wet strength and high electrical specifications are required.
Technical Information
- UN Number 3082 CL9
- Commodity Code 35061000
- Country of Origin Ireland
Data Sheets
Download the Loctite 3609 technical data sheet (TDS) and the Loctite 3609 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access datasheetsProduct Properties
Product Information
Features:
- Requires no mixing
- Heat Cure
- Surface Mount Adhesive
- Electronic components to printed circuit boards.
- Small Parts Bonding
- Dispense Method: Syringe
- Dispense Speed: Medium 15,000-25,000 dph
- Wet Strength: High
- Dot Profile: Peaked
- Operating Temperature: -54°C to +150°C
Additional Content
Shipping information
Please refer to our delivery page for more information.