Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C)
Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.
Technical Information
- Commodity Code 35069190
- Country of Origin China
Data Sheets
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Product Information
Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.
Applications:
Snap Cure Fast Flow Encapsulant Flip Chip Underfill
Additional Content
Shipping information
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