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EPO-TEK® H20S A/B Electrical Adhesive
EPO-TEK® H20S A/B Electrical Adhesive
Product Code: VAR0002082
From £389.33

Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding.

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EPO-TEK® H20S A/B Electrical Adhesive 8oz Kit

Silmid P/N: EPH20S08OZ
EPO-TEK® H20S A/B Electrical Adhesive 8oz Kit
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£2038.50 (excl VAT) £2446.20 (Inc VAT)
No Stock – Lead time 47 business days from date of order confirmation
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Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency.

Technical Information

  • UN Number 3082 CL9
  • Commodity Code 39073000
  • Country of Origin United States

Data Sheets

Download the EPO-TEK H20S A/B technical data sheet (TDS) and the EPO-TEK H20S A/B safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.
UK ONLY: There are export restrictions that apply to this product. If you would like to ship outside the UK, please contact your account manager or call us on +44 (0)1675 432850.

Product Properties

Pack Size
8oz Kit
Product Colour
Silver | Silver
Brand
EPO-TEK
Manufacturer Name
Epoxy Technology Inc
Manufacturer Part Number
ETH20S/8OZ

Product Information

Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency. Supplied in an 8oz kit.

Features:

  • High electrical conductivity
  • Short curing cycles
  • Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
  • Suggested for JEDEC level lll and ll plasticIC packaging
  • Low temperature cure makes it ideal for flex circuity and other low stress applications
  • Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
  • Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics

Shipping information

Please refer to our delivery page for more information.