EPO-TEK® H20S A/B Electrical Adhesive
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding.
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Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency.
High electrical conductivity
Short curing cycles
Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
Suggested for JEDEC level lll and ll plasticIC packaging
Low temperature cure makes it ideal for flex circuity and other low stress applications
Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics
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