EPO-TEK® H20S A/B Electrical Adhesive 1Lb Kit
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding. Supplied is a 1lb kit.
Technical Information
- UN Number 3082 CL9
- Commodity Code 39073000
- Country of Origin United States
Data Sheets
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Product Information
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency.
Features:
- High electrical conductivity
- Short curing cycles
- Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
- Suggested for JEDEC level lll and ll plasticIC packaging
- Low temperature cure makes it ideal for flex circuity and other low stress applications
- Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
- Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics
Shipping information
Please refer to our delivery page for more information.