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Epotek H20E Adhesive 1oz Kit

EPOH20E1OZ
Epotek H20E Adhesive 1oz Kit
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.
UN Number: UN3082 CL9 III
Limited Quantity: 5L

Advantages & Application Notes

  • Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
  • Suggested for JEDEC Level III and II for plastic IC packaging.
  • NASA approved and is NON TOXIC—complying with USP Class VI Biocompatibility Standards.
  • Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
  • Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
  • Especially suited for high power devices and high current flow. High power LEDs.
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Orders over £50 placed online will now qualify for FREE UK Mainland delivery*

Orders under £50 placed online for UK Mainland delivery is £6.95*

Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50** 

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.

Documents
Sil-Mid Limited DO NOT GUARANTEE that the information on this page is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.