EPO-TEK® H20E A/B Electrical Adhesive
Silmid P/N: VAR0002081
From £79.40 £95.28
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.
Data Sheets
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Brand
EPO-TEK
Manufacturer Part Number
ETH20E/1OZ | ETH20E/S3/2 | ETH20E/S3/3
Product Information
Advantages & Application Notes:
- Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
- Suggested for JEDEC Level III and II for plastic IC packaging.
- NASA approved and is NON TOXIC ”complying with USP Class VI Biocompatibility Standards.
- Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
- Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
- Especially suited for high power devices and high current flow. High power LEDs.
- Opto-electronic packaging material: LED, LCDs, and fiber optic components.
Shipping information
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