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EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.

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EPO-TEK® H20E A/B Electrical Adhesive 3gm/3ml Premixed Frozen (PMF) Syringe (Freezer Storage -40°C)

Silmid P/N: P0251063
£154.99 (excl VAT) £185.99 (Inc VAT)
In Stock - 4 Available
Lead time for additional units 61 business days from date of order confirmation
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EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.

Technical Information

  • UN Number 3082 CL9
  • Commodity Code 39073000
  • Country of Origin United States

Data Sheets

Download the EPO-TEK H20E A/B technical data sheet (TDS) and the EPO-TEK H20E A/B safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.
EXPORT CONTROL: This product is affected by export control regulations, and as such delivery will be limited to United Kingdom customers only. For more information, please contact your Account Manager, email info@silmid.com or call the office on +44 (0)1675 432 850.
FREEZER: This product should be stored in the freezer and it is recommended that orders are shipped with DRY ICE. Please click here to add this to your basket.
UK ONLY: There are export restrictions that apply to this product. If you would like to ship outside the UK, please contact your account manager or call us on +44 (0)1675 432850.

Product Properties

Pack Size
3gm/3ml Premixed Frozen (PMF) Syringe
Product Colour
Silver | Silver
Brand
EPO-TEK
Manufacturer Name
Epoxy Technology Inc
Manufacturer Part Number
ETH20E/S3/3

Product Information

Advantages & Application Notes:

  • Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
  • Suggested for JEDEC Level III and II for plastic IC packaging.
  • NASA approved and is NON TOXIC ”complying with USP Class VI Biocompatibility Standards.
  • Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
  • Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
  • Especially suited for high power devices and high current flow. High power LEDs.
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Shipping information

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