ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts.
UN Number: UN3082 CL9 III
Limited Quantity: 5L
SHELF LIFE: 365 DAYS
Please note: The shelf life remaining on receipt may be less
Key Features & Benefits
- Thermal conductivity - Dissipation of heat from bonded components
- Thixotropic paste - No flow or sag even on vertical surfaces
- Wide variety of catalysts available - Versatility of resin sustem
- Low coefficient of thermal expansion - Low stress on bonded components
ECCOBOND 285 is designed for bonding metals and ceramic substrates in heat sink applications or any application that requires a thermally conductive adhesive for thermal management. It is also useful for any application that requires a thixotropic paste adhesive and low stress bonds.
Orders over £50 placed online will now qualify for FREE UK Mainland delivery*
Orders under £50 placed online for UK Mainland delivery is £6.95*
Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50**
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.
Document DownloadsSil-Mid Limited DO NOT GUARANTEE that the information on this page is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.