Cho-Bond 584-208 Epoxy Adhesive 3oz Kit
CHO-BOND 584-208 is a two-component, silver-filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Technical Information
- UN Number 3082 CL9
- Commodity Code 71159000
- Country of Origin United States
Data Sheets
Download the Cho-Bond 584-208 technical data sheet (TDS) and the Cho-Bond 584-208 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access datasheetsProduct Properties
Product Information
CHO-BOND 584-208 is recommended for applications which require a conductive epoxy with an extended working life, such as high-volume part dispensing or complex part assembly operations. Curing of CHO-BOND 584-208 can be achieved in as little as 45 minutes with heat to minimize equipment downtime and increase manufacturing throughput. With a 1:1 weight mix ratio, CHO-BOND 584-208 is easy to handle and use. It can be dispensed through very small needles to fill cracks and voids, and is suitable for use on overhead or vertical surfaces.
Shipping information
Please refer to our delivery page for more information.