Cho-Bond 584-208 Epoxy Adhesive
Silmid P/N: VAR0000523
From £383.23 £459.88
Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212°F (100°C), the material offers volume resistivity of 0.005 ohm-cm.
Technical Information
- Commodity Code 71159000
- Country of Origin United States
- UN Number 3082 CL9
Product Information
Cho-Bond 584-208 Epoxy Adhesive 3oz Kit.
Data Sheets
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