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Cho-Bond 584-208 Epoxy Adhesive
Cho-Bond 584-208 Epoxy Adhesive
Product Code: VAR0000523
From £484.38

CHO-BOND 584-208 is a two-component, silver-filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

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Cho-Bond 584-208 Epoxy Adhesive 1Lb Kit

Silmid P/N: CB5842081LB
Cho-Bond 584-208 Epoxy Adhesive 1Lb Kit
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CHO-BOND 584-208 is a two-component, silver-filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

Technical Information

  • UN Number 3082 CL9
  • Commodity Code 71159000
  • Country of Origin United States
MARKET PRICE NOTICE: Due to ongoing volatility in global silver markets, pricing on certain silver-based products may fluctuate. Costs are reviewed regularly in line with market movements, and we continue to work closely with our suppliers to manage impact where possible.

Data Sheets

Download the Cho-Bond 584-208 technical data sheet (TDS) and the Cho-Bond 584-208 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
1Lb Kit
Product Colour
Silver | Silver
Brand
Chomerics Cho-Bond
Manufacturer Name
Parker Hannifin Corporation
Manufacturer Part Number
50-01-0584-0208

Specifications

Airbus Helicopters CM
CM6244

Please Note: Specifications and approvals are subject to change at any time. Users should always consult their AMM or the OEM when selecting products to ensure items have the release needed. Only specifications listed on the order confirmation will be certified on the Silmid CofC.

Product Information

CHO-BOND 584-208 is recommended for applications which require a conductive epoxy with an extended working life, such as high-volume part dispensing or complex part assembly operations. Curing of CHO-BOND 584-208 can be achieved in as little as 45 minutes with heat to minimize equipment downtime and increase manufacturing throughput. With a 1:1 weight mix ratio, CHO-BOND 584-208 is easy to handle and use. It can be dispensed through very small needles to fill cracks and voids, and is suitable for use on overhead or vertical surfaces.

Shipping information

Please refer to our delivery page for more information.