Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit *BMS 5-35F Type I Grade B

CHO-BOND 360 is recommended as a thermo-setting EMI/RFI shielding compound. It is excellent for poorly tolerance, non-flat surfaces coated with a thin dielectric layer, and it's coarse granular silver-plated copper filler abrades thin oxides from aluminum, copper, and galvanised steel, especially when applied between flanges under modest contact pressure. Applications typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding, environmental sealing, and EMI shielding of cast aluminum housings; the bonding and shielding of conduit bulkhead passthroughs. This product has excellent adhesion to dissimilar substrates, but due to its strong bonding properties, it should not be used where the seam may need to be broken in the future.

CHO-BOND 360-20 conductive adhesive is the lowest-cost variant of CHO-BOND 360. It is easy to mix with a 1:1 ratio, offers the highest conductivity and lap shear bond strength and cures at room temperature. The adhesive fills large gaps, provides good thermal shock resistance and has a one-hour pot life.