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CHO-BOND 360 compound is an electrically conductive epoxy adhesive that combines the good characteristics of epoxy, and the superior electrical conductivity of silver.

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Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit *BMS 5-35 Type I Grade B

Silmid P/N: CH360201LB
No Stock - Standard lead time 38 business days
Please order in multiples of 3

CHO-BOND 360 compound is an electrically conductive epoxy adhesive that combines the good characteristics of epoxy, and the superior electrical conductivity of silver.

Technical Information

  • Commodity Code 74061000
  • Country of Origin United States

Data Sheets

Download the Cho-Bond 360-20 technical data sheet (TDS) and the Cho-Bond 360-20 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
1Lb Kit
Product Colour
Grey | Silver
Brand
Chomerics Cho-Bond
Manufacturer Name
Parker Hannifin Corporation
Manufacturer Part Number
50-01-0360-0020

Specifications

Boeing
BMS 5-35 Type I Grade B

Please Note: Specifications and approvals are subject to change at any time. Users should always consult their AMM or the OEM when selecting products to ensure items have the release needed. Only specifications listed on the order confirmation will be certified on the Silmid CofC.

Product Information

It is recommended as a thermo-setting EMI/RFI shielding compound and is excellent for poorly toleranced, non-flat surfaces which have been coated with a thin dielectric layer. Its coarse granular silver-plated copper filler will abrade thin oxides from aluminium, copper and galvanised steel, especially when applied between flanges under modest contact pressure.

Applications typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding, environmental sealing, and EMI shielding of cast aluminium housings; the bonding and shielding of conduit bulkhead passthroughs.

This product has excellent adhesion to dissimilar substrates. Because of its excellent adhesive properties, it should not be used if it is anticipated that the seam will be ‘broken' at a future date.

CHO-BOND 360-20 conductive adhesive is the lowest cost variant of CHO-BOND 360, easiest to mix with a 1:1 mix ratio, is most conductive, has the highest lap shear bond strength, may be room-temperature cured, fills large gaps, and has good thermal shock resistance. It has a one-hour pot life.

Shipping information

Orders over £100 placed online will now qualify for FREE UK Mainland delivery*

**orders placed through the office will incur additional charges.** 

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.

Please refer to our delivery page for more information.