Devcon 5 Minute Epoxy Adhesive
Devcon 5 Minute Epoxy is a rapid-curing, general-purpose adhesive/encapsulant that forms a hard, rigid bond or coating in minutes.
Data Sheets
Download the Devcon 5 technical data sheet (TDS) and the Devcon 5 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select size/colour from the dropdown to access datasheetsProduct Properties
Specifications
Please Note: Specifications and approvals are subject to change at any time. Users should always consult their AMM or the OEM when selecting products to ensure items have the release needed. Only specifications listed on the order confirmation will be certified on the Silmid CofC.
Product Information
This adhesive is a 100% reactive, solvent-free formulation that offers good dielectric strength and excellent resistance to solvents. It cures quickly, making it ideal for fast metal-to-metal bonding and repairs, and is also well suited for potting and encapsulating electronic components and assemblies. It is suitable for bonding a wide range of materials including metals, fabrics, ceramics, glass, wood, and concrete.
Shipping information
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