Devcon 5 Minute Epoxy Adhesive
Devcon 5 Minute Epoxy is a rapid-curing, general-purpose adhesive/encapsulant that forms a hard, rigid bond or coating in minutes.
Data SheetsDownload the Devcon 5 technical data sheet (TDS) and the Devcon 5 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select size/colour from the dropdown to access datasheets
Please Note: Specifications and approvals are subject to change at any time. Users should always consult their AMM or the OEM when selecting products to ensure items have the release needed. Only specifications listed on the order confirmation will be certified on the Silmid CofC.
- 100% reactive, no solvents
- Good dielectric strength
- Good solvent resistance
- Cures fast for quick metal to metal bonding and repairs
- Pots and encapsulates electronic components and assemblies
- Suitable for bonding metals, fabrics, ceramics, glass, wood and concrete (in combinations)
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