Loctite Ablestik ABP 8064 T Die Attach Adhesive
Loctite Ablestik ABP 8064 T highly filled, conductive dieattach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
Data Sheets
Download the Loctite Ablestik ABP 8064 T technical data sheet (TDS) and the Loctite Ablestik ABP 8064 T safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select size/colour from the dropdown to access datasheetsProduct Properties
Product Information
Features:
- High thermal conductivity
- High electrical conductivity
- Medium modulus
- Low outgassing
- Stable at high temperatures
- Good reliability performance
- Soft solder replacement
Additional Content
Shipping information
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