Alpha OM338-T (SN96.5/AG3.0/CU0.5) Solder Paste 500gm Pot (Fridge Storage)
Alpha OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications.
Technical Information
- Commodity Code 38101000
- Country of Origin Hungary
Data Sheets
Download the Alpha OM338-T (SN96.5/AG3.0/CU0.5) technical data sheet (TDS) and the Alpha OM338-T (SN96.5/AG3.0/CU0.5) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access datasheetsProduct Properties
Product Information
Alpha OM-338-T's broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. It yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.
The outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. Additionally, Alpha OM-338-T is formulated to deliver exceptional visual joint cosmetics.
Shipping information
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