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CHO-THERM 1641 compound is a one-component, thermally conductive, electrically insulating (non-acetic acid generating), silicone-based RTV adhesive/sealant/potting compound. The material offers high thermal conductivity, flexibility, excellent high and low-temperature resistance, as well as electrical insulation.

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Cho-Therm 1641 A/B Silicone Compound 2.5oz Kit (Includes 1086 Primer)

Silmid P/N: CH164125OZ
£65.79 (excl VAT) £78.95 (Inc VAT)
In Stock - 30 Available
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CHO-THERM 1641 compound is a one-component, thermally conductive, electrically insulating (non-acetic acid generating), silicone-based RTV adhesive/sealant/potting compound. The material offers high thermal conductivity, flexibility, excellent high and low-temperature resistance, as well as electrical insulation.

Technical Information

  • UN Number 1992 CL3 (6.1)
  • Commodity Code 76169990
  • Country of Origin United States

Data Sheets

Download the Cho-Therm 1641 A/B technical data sheet (TDS) and the Cho-Therm 1641 A/B safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
2.5oz Kit
Product Colour
Grey | Clear
Brand
Chomerics Cho-Therm
Manufacturer Name
Parker Hannifin Corporation
Manufacturer Part Number
65-00-1641-0000

Product Information

CHO-THERM 1641 allows components of circuits encapsulated in the cured compound to be accessed by cutting away the material, and after repair, the components can be re-encapsulated with no loss in performance.

CHO-THERM 1641 compound will adhere, but not permanently bond, to most non-silicone surfaces, though a permanent bond can be achieved using Chomerics’ CHO-BOND 1086 primer(included in this kit). If easy removal is needed, the package and heat sink should be brush painted with a mould release before application. Components potted in CHO-THERM 1641 compound have excellent thermal and mechanical shock resistance, thermal diffusivity and moisture resistance.

CHO-THERM 1641 compound can also be used as a cure-in-place thermal grease, with excess material curing to resist vapor degreasing while achieving very low thermal impedance. The cured CHO-THERM 1641 compound will not separate or migrate on the heat sink or circuit board.

Shipping information

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