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CHO-BOND 1030 is a silver-plated, copper-filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. For optimal results, CHO-BOND 1030 is recommended for use with CHO-BOND 1086 primer. CHO-BOND 1086 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.

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Cho-Bond 1030 Electrically Conductive Silicone Gasket Adhesive 113.4gm Tube (Includes 1086 Primer) *HMS16-1157

Silmid P/N: CH10301086
£118.23 (excl VAT) £141.88 (Inc VAT)
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CHO-BOND 1030 is a silver-plated, copper-filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. For optimal results, CHO-BOND 1030 is recommended for use with CHO-BOND 1086 primer. CHO-BOND 1086 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.

Technical Information

  • UN Number 1992 CL3 (6.1)
  • Commodity Code 35061000
  • Country of Origin United States

Data Sheets

Download the Cho-Bond 1030/1086 technical data sheet (TDS) and the Cho-Bond 1030/1086 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
113.4gm Tube
Product Colour
Light Grey | Clear
Brand
Chomerics Cho-Bond
Manufacturer Name
Parker Hannifin Corporation
Manufacturer Part Number
50-02-1030-0000-55E

Specifications

NSN Reference
8040-01-015-3805
Airbus CML
08-132
Boeing
HMS16-1157
Airbus Helicopters CM
CM6107

Please Note: Specifications and approvals are subject to change at any time. Users should always consult their AMM or the OEM when selecting products to ensure items have the release needed. Only specifications listed on the order confirmation will be certified on the Silmid CofC.

Product Information

CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches.

With no volatile organic compounds (VOCs) and minimal shrinkage during curing, it is an ideal choice for a wide range of commercial and military applications. CHO-BOND 1030's moisture cure silicone polymer system allows it to cure to the touch within 24 hours and provides a robust conductive bond over a wide range of application temperatures. No corrosive by-products are generated during curing, preventing damage to the substrate. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows.

For best adhesion results, CHO-BOND 1030 should be used in conjunction with CHO SHIELD 1086 primer (supplied in this kit). CHO-BOND 1086 is moisture reactive and clear in colour.

Shipping information

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