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EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive
EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive
Product Code: VAR0002079
From £13.96

EPO-TEK 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK brand products, and is known throughout the world for its performance and reliability

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EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive 1Lb Kit

Silmid P/N: EP353ND1LB
EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive 1Lb Kit
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£219.77 (excl VAT) £263.72 (Inc VAT)
No Stock – Lead time 61 business days from date of order confirmation
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EPO-TEK 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK brand products, and is known throughout the world for its performance and reliability

Technical Information

  • UN Number 3082 CL9 / 3267 CL8
  • Commodity Code 39073000
  • Country of Origin United States

Data Sheets

Download the EPO-TEK 353ND A/B technical data sheet (TDS) and the EPO-TEK 353ND A/B safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.
UK ONLY: There are export restrictions that apply to this product. If you would like to ship outside the UK, please contact your account manager or call us on +44 (0)1675 432850.

Product Properties

Pack Size
1Lb Kit
Product Colour
Clear | Amber
Brand
EPO-TEK
Manufacturer Name
Epoxy Technology Inc
Manufacturer Part Number
ET353ND/1LB

Product Information

Epo-tek 353ND Advantages Application Notes:

  • Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
  • NASA approved, low outgassing epoxy - http://outgassing.nasa.gov/
  • Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
  • Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging o Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
  • Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications: o Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range o Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays

Medical suggested applications:

  • Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma
  • Certified to USP Class VI Biocompatiblility Standards for medical implants; adhesive for catheter devices including stents and guide wires

Electronics Assembly suggested Applications:

  • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
  • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and

Shipping information

Please refer to our delivery page for more information.