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Cho-Bond 584-29 Epoxy Adhesive
Cho-Bond 584-29 Epoxy Adhesive
Product Code: VAR0000524
From £11.03

CHO-BOND 584-29 is a two-component, silver-filled conductive epoxy adhesive formulated for applications where a strong, highly conductive electrical bond must be achieved.

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Cho-Bond 584-29 Epoxy Adhesive 3oz Kit

Silmid P/N: CH584293OZ
Cho-Bond 584-29 Epoxy Adhesive 3oz Kit
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CHO-BOND 584-29 is a two-component, silver-filled conductive epoxy adhesive formulated for applications where a strong, highly conductive electrical bond must be achieved.

Technical Information

  • UN Number 3082 CL9 / 2735 CL8
  • Commodity Code 71159000
  • Country of Origin United States
MARKET PRICE NOTICE: Due to ongoing volatility in global silver markets, pricing on certain silver-based products may fluctuate. Costs are reviewed regularly in line with market movements, and we continue to work closely with our suppliers to manage impact where possible.

Data Sheets

Download the Cho-Bond 584-29 technical data sheet (TDS) and the Cho-Bond 584-29 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
3oz Kit
Product Colour
Silver | Amber
Brand
Chomerics Cho-Bond
Manufacturer Name
Parker Hannifin Corporation
Manufacturer Part Number
50-00-0584-0029

Product Information

CHO-BOND 584-29 is recommended for small bond lines (less than 0.010 inches), but may also be used for larger bond lines where vibration and potential for cracking are not concerns. The fine silver filler in CHO-BOND 584-29 makes it ideal for precise applications in and around tight spaces and electrical components, and its thin paste consistency allows dispensing through very small needles to fill cracks and voids. The product has a 30-minute working life, works over a wide temperature range, delivers good chemical resistance, and provides high lap shear strength (>1200psi) for permanent bonding of surfaces.

With heat, curing can be achieved in as little as 15 minutes, minimizing equipment downtime and increasing manufacturing throughput. Typical applications include bonding and grounding electrical components, cold soldering, and bonding or sealing machined enclosures.

Shipping information

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