Cho-Bond 584-29 Epoxy Adhesive
CHO-BOND 584-29 is a two-component, silver-filled conductive epoxy adhesive formulated for applications where a strong, highly conductive electrical bond must be achieved.
Data Sheets
Download the Cho-Bond 584-29 technical data sheet (TDS) and the Cho-Bond 584-29 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select size/colour from the dropdown to access datasheetsProduct Properties
Specifications
Please Note: Specifications and approvals are subject to change at any time. Users should always consult their AMM or the OEM when selecting products to ensure items have the release needed. Only specifications listed on the order confirmation will be certified on the Silmid CofC.
Product Information
CHO-BOND 584-29 is recommended for small bond lines (less than 0.010 inches), but may also be used for larger bond lines where vibration and potential for cracking are not concerns. The fine silver filler in CHO-BOND 584-29 makes it ideal for precise applications in and around tight spaces and electrical components, and its thin paste consistency allows dispensing through very small needles to fill cracks and voids. The product has a 30-minute working life, works over a wide temperature range, delivers good chemical resistance, and provides high lap shear strength (>1200psi) for permanent bonding of surfaces.
With heat, curing can be achieved in as little as 15 minutes, minimizing equipment downtime and increasing manufacturing throughput. Typical applications include bonding and grounding electrical components, cold soldering, and bonding or sealing machined enclosures.
Shipping information
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