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EPO-TEK® H20S A/B Electrical Adhesive
EPO-TEK® H20S A/B Electrical Adhesive
Product Code: VAR0002082
From £389.33

Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding.

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EPO-TEK® H20S A/B Electrical Adhesive 1oz Kit

Silmid P/N: EPH20S01OZ
EPO-TEK® H20S A/B Electrical Adhesive 1oz Kit
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£432.59 (excl VAT) £519.11 (Inc VAT)
No Stock – Lead time 54 business days from date of order confirmation
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Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency

Technical Information

  • UN Number 3082 CL9
  • Commodity Code 35061000
  • Country of Origin United States
UK ONLY: There are export restrictions that apply to this product. If you would like to ship outside the UK, please contact your account manager or call us on +44 (0)1675 432850.

Data Sheets

Download the EPO-TEK H20S A/B technical data sheet (TDS) and the EPO-TEK H20S A/B safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
1oz Kit
Product Colour
Silver | Silver
Brand
EPO-TEK
Manufacturer Name
Epoxy Technology Inc
Manufacturer Part Number
ETH20S/1OZ

Product Information

Features:

  • High electrical conductivity
  • Short curing cycles
  • Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
  • Suggested for JEDEC level lll and ll plasticIC packaging
  • Low temperature cure makes it ideal for flex circuity and other low stress applications
  • Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
  • Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics

Shipping information

Please refer to our delivery page for more information.