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Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C)
Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.
Technical Information
- Commodity Code 35069190
- Country of Origin China
Data Sheets
Download the Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C) technical data sheet (TDS) and the Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.
Applications:
Snap Cure Fast Flow Encapsulant Flip Chip Underfill
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.