Quick View

Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.

 See Options
Bulk discounts
1+
$267.09 + VAT
10+
$253.74 + VAT
20+
$247.06 + VAT
40+
$240.38 + VAT
Basket
Skip to main content
  • basket icon Order & Quote Functionality
  • door icon No Minimum Order Value
  • paper icon Technical Document Library

Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C)

Silmid P/N: FP453010
$267.09 (excl VAT) $267.09 (Inc VAT)
On Order - 10 due in 56 business days
10 due in 84 business days
Bulk discounts
1+
$267.09 + VAT
10+
$253.74 + VAT
20+
$247.06 + VAT
40+
$240.38 + VAT

Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.

Technical Information

  • Commodity Code 35069190
  • Country of Origin China

Data Sheets

Download the Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C) technical data sheet (TDS) and the Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Information

Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.

Applications:

Snap Cure Fast Flow Encapsulant Flip Chip Underfill

Shipping information

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.

Please refer to our delivery page for more information.