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Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.

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Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C)

Silmid P/N: FP453010
$267.64 (excl VAT) $267.64 (Inc VAT)
On Order - 8 available in 10 days
8 available in 31 days
72 available in 10 days
Bulk discounts
1+
$267.64 + VAT
10+
$254.26 + VAT
20+
$247.57 + VAT
40+
$240.88 + VAT

Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.

Technical Information

  • Commodity Code 35069190
  • Country of Origin China

Data Sheets

Download the Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C) technical data sheet (TDS) and the Loctite Eccobond FP4530 Underfill Epoxy Adhesive 10cc/10ml Syringe (Freezer Storage -40°C) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Information

Hysol FP4530 underfill is designed to flip chip on flex applications with 25micron gap. Upon cure the material will change from blue to green.

Applications:

Snap Cure Fast Flow Encapsulant Flip Chip Underfill

Shipping information

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.

Please refer to our delivery page for more information.