Cho-Bond 1075/1086 Electrically Conductive Sealant
CHO-BOND 1075 is a silver-plated, aluminium-filled, conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
Data Sheets
Download the Cho-Bond 1075/1086 Electrically Conductive Sealant technical data sheet (TDS) and the Cho-Bond 1075/1086 Electrically Conductive Sealant safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Information
The minimum recommended bond line for CHO-BOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminium filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminium substrates.
No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075's moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures.
CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer (supplied in this kit) for best adhesion results. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
Shipping information
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