Cho-Bond 1085 Silicone Adhesive Primer 1USP Can
CHO-BOND 1085 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds to metal and other non-silicone substrates.
Technical Information
- UN Number 1993 CL3
- Commodity Code 39100000
- Country of Origin United States
Data Sheets
Download the Cho-Bond 1085 Silicone Adhesive Primer 1USP Can technical data sheet (TDS) and the Cho-Bond 1085 Silicone Adhesive Primer 1USP Can safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
CHO-BOND 1085 primer is formulated to achieve maximum adhesion on non-silicone substrates for CHO-BOND 1029 adhesive. The primer is moisture reactive and clear in colour. This product cures at room temperature and becomes fully functional in approximately 30 minutes, allowing for quick and convenient application without the need for heat.
Shipping information
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