Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C)
LOCTITE ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal lead frames.
Technical Information
- Commodity Code 35061000
- Country of Origin South Korea
Data Sheets
Download the Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C) technical data sheet (TDS) and the Loctite Ablestik QMI519 Heat Cure Adhesive 5cc Syringe (Freezer Storage -40°C) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realised through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
Features:
- Electrically conductive
- Thermally conductive
- One component
- Ease of use Void-free bondline
- Hydrophobic Stable at high temperatures
- High resistance to delamination
- Good resistance to
popcorning
after exposure to reflow temperatures
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.