$187.79 + VAT
$178.40 + VAT
$173.72 + VAT
$169.02 + VAT
- It is a thixotropic paste and a non-sagging adhesive. It is also useful for deposition methods like dispensing, printing, or hand held processes.
- Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.
- Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT.
- Reinforcing and extra mechanical support for wire bond integrity.
- Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs.
- Adhesion to FR4 and common PCB substrates and housings
Specifications and Information
$187.79 excl VAT
($187.79 Inc VAT)
No stock - lead time 31 days
UN3082 CL9 III
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