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EPO-TEK® H61 A/B Thermally Conductive Epoxy Adhesive 3oz Kit (Fridge Storage)

EPO-TEK® H61 A/B Thermally Conductive Epoxy Adhesive 3oz Kit (Fridge Storage)
EPOH61E3OZ
EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. Read more
$187.79 excl VAT
($187.79 Inc VAT)
No stock - lead time 31 days
Bulk discounts
1+
$187.79 + VAT
12+
$178.40 + VAT
24+
$173.72 + VAT
48+
$169.02 + VAT

Product Information

Features

  • It is a thixotropic paste and a non-sagging adhesive. It is also useful for deposition methods like dispensing, printing, or hand held processes.

Suggested Applications

  • Hybrid
  • Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.
  • Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT.
  • Reinforcing and extra mechanical support for wire bond integrity.
  • Electronics
  • Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs.
  • Adhesion to FR4 and common PCB substrates and housings

 

Specifications and Information

Technical Information

$187.79 excl VAT
($187.79 Inc VAT)
No stock - lead time 31 days
Product Code
EPOH61E3OZ
Commodity Code
35069190
UN Number
UN3082 CL9 III

Document Downloads

Sil-Mid Limited DO NOT GUARANTEE that the information in these documents is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.

Delivery information

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.

Please refer to our delivery page for more information.