EPO-TEK® H20E A/B Electrical Adhesive 1oz Kit
Silmid P/N: EPOH20E1OZ
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.
Technical Information
- UN Number 3082 CL9
- Commodity Code 39073000
- Country of Origin United States
PRICE FLUCTUATION: This product is on request due to price fluctuations in the raw material. For an up to date quote please click the "Request Quote" button.
UK ONLY: There are export restrictions that apply to this product. If you would like to ship outside the UK, please contact your account manager or call us on +44 (0)1675 432850.
Data Sheets
Download the EPO-TEK® H20E A/B Electrical Adhesive 1oz Kit technical data sheet (TDS) and the EPO-TEK® H20E A/B Electrical Adhesive 1oz Kit safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
Advantages & Application Notes:
- Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
- Suggested for JEDEC Level III and II for plastic IC packaging.
- NASA approved and is NON TOXIC ”complying with USP Class VI Biocompatibility Standards.
- Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
- Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
- Especially suited for high power devices and high current flow. High power LEDs.
- Opto-electronic packaging material: LED, LCDs, and fiber optic components.
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.