- This material is hydrophobic and stable
at high temperatures.
- These features produce a void-free bond
line with excellent interfacial adhesion strength to a wide
variety of metal surfaces, including Palladium, Alloy 42 .
- The adhesive also has excellent electrical and thermal conductivity properties.
- QMI519â„¢ is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives.