Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit *BMS 5-35 Type I Grade B

It is recommended as a thermo-setting EMI/RFI shielding compound and is excellent for poorly toleranced, non-flat surfaces which have been coated with a thin dielectric layer. Its coarse granular silver-plated copper filler will abrade thin oxides from aluminium, copper and galvanised steel, especially when applied between flanges under modest contact pressure.

Applications typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding, environmental sealing, and EMI shielding of cast aluminium housings; the bonding and shielding of conduit bulkhead passthroughs.

This product has excellent adhesion to dissimilar substrates. Because of its excellent adhesive properties, it should not be used if it is anticipated that the seam will be ‘broken' at a future date.

CHO-BOND 360-20 conductive adhesive is the lowest cost variant of CHO-BOND 360, easiest to mix with a 1:1 mix ratio, is most conductive, has the highest lap shear bond strength, may be room-temperature cured, fills large gaps, and has good thermal shock resistance. It has a one-hour pot life.