EPO-TEK® H20S A/B Electrical Adhesive
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding.
Data Sheets
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Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency.
Features:
- High electrical conductivity
- Short curing cycles
- Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
- Suggested for JEDEC level lll and ll plasticIC packaging
- Low temperature cure makes it ideal for flex circuity and other low stress applications
- Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
- Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics
Shipping information
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