Therm-A-Gap 30 Thermally Conductive Compound

THERM-A-GAP Gel 30 provides low thermal impedance across both thin and thick gaps, enabling the use of common heat spreaders. It requires no mixing or curing, providing superior design flexibility. It has demonstrated proven reliability under extreme temperature cycling as well as shock and vibration conditions. Designed to deflect easily under very low compressive forces, it reduces stress on components and helps decrease the likelihood of component failures. It's versatility allows it to accommodate a variety of bond line thicknesses for application across multiple devices, and it has been successfully used to fill gaps of different thicknesses. In addition, it is fully compatible with high-volume, automated dispense processes and meets Telcordia (Bellcore) silicone specifications.