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CHO-BOND 1086 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds to metal and other non-silicone substrates.

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Cho-Bond 1086 Silicone Adhesive Primer 1USP Can

Silmid P/N: CH10860USP
$251.88 (excl VAT) $251.88 (Inc VAT)
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CHO-BOND 1086 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds to metal and other non-silicone substrates.

Technical Information

  • UN Number 1992 CL3 (6.1)
  • Commodity Code 35061000
  • Country of Origin United States

Data Sheets

Download the Cho-Bond 1086 Silicone Adhesive Primer 1USP Can technical data sheet (TDS) and the Cho-Bond 1086 Silicone Adhesive Primer 1USP Can safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Information

CHO-BOND 1086 is moisture reactive and clear in colour. CHO-BOND 1086 primer is formulated for use with CHO-BOND 1016, 1030, 1035, 1038, and 1075 electrically conductive adhesives and sealants, as well as CHO-THERM 1641 thermal compound. This product cures at room temperature and becomes fully functional in approximately 30 minutes, allowing for quick and convenient application without the need for heat.

Shipping information

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