DOWSIL™ TC-5622 Thermally Conductive Compound 1Kg Can
DOWSIL TC-5622 is a flowable, non-curing thermally conductive compound designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.
Technical Information
- Commodity Code 38249996
- Country of Origin United States
Data Sheets
Download the DOWSIL™ TC-5622 technical data sheet (TDS) and the DOWSIL™ TC-5622 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Properties
Product Information
Features:
- Solventless formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
Shipping information
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