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EPO-TEK® H20E A/B Electrical Adhesive 1oz Kit

EPO-TEK® H20E A/B Electrical Adhesive 1oz Kit
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. Read more

Product Information

Advantages & Application Notes

  • Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
  • Suggested for JEDEC Level III and II for plastic IC packaging.
  • NASA approved and is NON TOXIC—complying with USP Class VI Biocompatibility Standards.
  • Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
  • Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
  • Especially suited for high power devices and high current flow. High power LEDs.
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components.