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EPO-TEK® H20E A/B Electrical Adhesive
EPO-TEK® H20E A/B Electrical Adhesive
Product Code: VAR0002081
From $73.07

EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.

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EPO-TEK® H20E A/B Electrical Adhesive 3gm/3ml Premixed Frozen (PMF) Syringe (Freezer Storage -40°C)

Silmid P/N: P0251063
EPO-TEK® H20E A/B Electrical Adhesive 3gm/3ml Premixed Frozen (PMF) Syringe (Freezer Storage -40°C)
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$228.86 (excl VAT) $228.86 (Inc VAT)
No Stock – Typically ships in 68 business days from order date
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EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.

Technical Information

  • UN Number 3082 CL9
  • Commodity Code 39073000
  • Country of Origin United States
EXPORT CONTROL: This product is affected by export control regulations, and as such delivery will be limited to United Kingdom customers only. For more information, please contact your Account Manager, email info@silmid.com or call the office on +44 (0)1675 432 850.
FREEZER: This product should be stored in the freezer and it is recommended that orders are shipped with DRY ICE. Please click here to add this to your basket.
UK ONLY: There are export restrictions that apply to this product. If you would like to ship outside the UK, please contact your account manager or call us on +44 (0)1675 432850.

Data Sheets

Download the EPO-TEK H20E A/B technical data sheet (TDS) and the EPO-TEK H20E A/B safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.

Product Properties

Pack Size
2gm/3ml Premixed Frozen (PMF) Syringe
Product Colour
Silver | Silver
Brand
EPO-TEK
Manufacturer Name
Epoxy Technology Inc
Manufacturer Part Number
ETH20E/S3/3

Product Information

Advantages & Application Notes:

  • Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
  • Suggested for JEDEC Level III and II for plastic IC packaging.
  • NASA approved and is NON TOXIC ”complying with USP Class VI Biocompatibility Standards.
  • Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
  • Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
  • Especially suited for high power devices and high current flow. High power LEDs.
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Shipping information

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.

Please refer to our delivery page for more information.