Cho-Bond 584-208 Epoxy Adhesive
CHO-BOND 584-208 is a two-component, silver-filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Data Sheets
Download the Cho-Bond 584-208 Epoxy Adhesive 3oz Kit technical data sheet (TDS) and the Cho-Bond 584-208 Epoxy Adhesive 3oz Kit safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
CHO-BOND 584-208 is recommended for applications which require a conductive epoxy with an extended working life such as high-volume part dispensing or complex part assembly operations. With no VOCs and minimal shrinkage, CHO-BOND 584-208 is a good choice for a range of applications.
Curing of CHO-BOND 584-208 can be achieved in as little as 45 minutes with heat to minimize equipment downtime and increase manufacturing throughput. With a 1:1 weight mix ratio, CHO-BOND 584-208 is easy to handle and use.
Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.