Cho-Bond 360-208 Epoxy Adhesive Caulk

CHO-BOND 360 is recommended as a thermo-setting EMI/RFI shielding compound. It is excellent for poorly tolerance, non-flat surfaces coated with a thin dielectric layer, and it's coarse granular silver-plated copper filler abrades thin oxides from aluminium, copper, and galvanised steel, especially when applied between flanges under modest contact pressure. Applications typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding, environmental sealing, and EMI shielding of cast aluminium housings; the bonding and shielding of conduit bulkhead passthroughs. This product has excellent adhesion to dissimilar substrates, but due to its strong bonding properties, it should not be used where the seam may need to be broken in the future.

CHO-BOND 360-208 is a more cost-effective alternative to CHO-BOND 360-20. Formulated with conductive filler in both the resin and hardener, it delivers excellent shielding performance, requires no contact pressure, cures at room temperature, and provides strong resistance to thermal shock. With its higher silver content, CHO-BOND 360-208 offers superior shielding when only a fillet can be applied, and it has a one-hour pot life.