Devcon 5 Minute Epoxy Adhesive
Devcon 5 Minute Epoxy is a rapid-curing, general-purpose adhesive/encapsulant that forms a hard, rigid bond or coating in minutes.
Data Sheets
Download the Devcon 5 Minute Epoxy Adhesive technical data sheet (TDS) and the Devcon 5 Minute Epoxy Adhesive safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Information
This adhesive is a 100% reactive, solvent-free formulation that offers good dielectric strength and excellent resistance to solvents. It cures quickly, making it ideal for fast metal-to-metal bonding and repairs, and is also well suited for potting and encapsulating electronic components and assemblies. It is suitable for bonding a wide range of materials including metals, fabrics, ceramics, glass, wood, and concrete.
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.