Cho-Bond 584-29 Epoxy Adhesive

CHO-BOND 584-29 is recommended for small bond lines (less than 0.010 inches), but may also be used for larger bond lines where vibration and potential for cracking are not concerns. The fine silver filler in CHO-BOND 584-29 makes it ideal for precise applications in and around tight spaces and electrical components, and its thin paste consistency allows dispensing through very small needles to fill cracks and voids. The product has a 30-minute working life, works over a wide temperature range, delivers good chemical resistance, and provides high lap shear strength (>1200psi) for permanent bonding of surfaces.

With heat, curing can be achieved in as little as 15 minutes, minimizing equipment downtime and increasing manufacturing throughput. Typical applications include bonding and grounding electrical components, cold soldering, and bonding or sealing machined enclosures.